Physical Vapour Deposition

PVD or Physical Vapour Deposition is a vacuum technique that allows to deposit coatings by condensation of vaporized target material. During their transport towards the substrate, atoms can react with reactive gasses. Various metallic and compound films can be formed: Ti, Cr, Al, TiAlN, CrN, AlN , Al2O3, etc. Deposition temperature ranges from room temperature to 550 °C, and the obtained coating thickness goes up to 5 µm.

The PVD technique is known in coating industry to result in coatings with improved hardness and wear resistance, reduced friction, improved oxidation resistance, etc.

With the newly developed HIPIMS (High Power Impulse Magnetron Sputtering ) technology, coatings with improved properties (higher density, improved adhesion, …) can be applied to surfaces and products. 

Equipment

Our lab is equipped with the latest PVD equipment to produce multifunctional and smart coatings. The Hauzer Flexicoat can be configured to utilize every indicated vacuum technique alone or in combination to obtain new properties and multifunctional coatings.